JPH0214509A - チップ部品の保持プレート - Google Patents
チップ部品の保持プレートInfo
- Publication number
- JPH0214509A JPH0214509A JP1112461A JP11246189A JPH0214509A JP H0214509 A JPH0214509 A JP H0214509A JP 1112461 A JP1112461 A JP 1112461A JP 11246189 A JP11246189 A JP 11246189A JP H0214509 A JPH0214509 A JP H0214509A
- Authority
- JP
- Japan
- Prior art keywords
- elastic material
- holes
- chip
- holding plate
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013013 elastic material Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 238000003860 storage Methods 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 15
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000007769 metal material Substances 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1112461A JPH0214509A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレート |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1112461A JPH0214509A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレート |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61099009A Division JPS61268003A (ja) | 1986-04-28 | 1986-04-28 | チツプ部品の保持プレ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0214509A true JPH0214509A (ja) | 1990-01-18 |
| JPH0542124B2 JPH0542124B2 (en]) | 1993-06-25 |
Family
ID=14587215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1112461A Granted JPH0214509A (ja) | 1989-05-01 | 1989-05-01 | チップ部品の保持プレート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0214509A (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558018A (en) * | 1978-06-30 | 1980-01-21 | Taiyo Yuden Kk | Method of attaching electronic part |
| JPS5890718A (ja) * | 1981-10-22 | 1983-05-30 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | コ−デイング処理用電子パ−ツ支持板 |
-
1989
- 1989-05-01 JP JP1112461A patent/JPH0214509A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558018A (en) * | 1978-06-30 | 1980-01-21 | Taiyo Yuden Kk | Method of attaching electronic part |
| JPS5890718A (ja) * | 1981-10-22 | 1983-05-30 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | コ−デイング処理用電子パ−ツ支持板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0542124B2 (en]) | 1993-06-25 |
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